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BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8182TB
3 V, 2.9 GHz SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS
DESCRIPTION
The PC8182TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC operates at 3 V. The medium output power is suitable for RF-TX of mobile communications system. This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
* Supply voltage: VCC = 2.7 to 3.3 V * Circuit current: ICC = 30 mA TYP. @ VCC = 3.0 V * Medium output power: PO (1dB) = +9.5 dBm TYP. @ f = 0.9 GHz PO (1dB) = +9.0 dBm TYP. @ f = 1.9 GHz PO (1dB) = +8.0 dBm TYP. @ f = 2.4 GHz * Power gain: GP = 21.5 dB TYP. @ f = 0.9 GHz GP = 20.5 dB TYP. @ f = 1.9 GHz GP = 20.5 dB TYP. @ f = 2.4 GHz * Upper limit operating frequency: fu = 2.9 GHz TYP. @ 3 dB bandwidth * High-density surface mounting: 6-pin super minimold package (2.0 x 1.25 x 0.9 mm)
APPLICAION
* Buffer amplifiers on 1.9 to 2.4 GHz mobile communications system
ORDERING INFORMATION (Solder Contains Lead)
Part Number Package 6-pin super minimold Marking C3F Supplying Form * Embossed tape 8 mm wide * Pin 1, 2, 3 face the perforation side of the tape * Qty 3 kpcs/reel
PC8182TB-E3
Remark To order evaluation samples, contact you're nearby sales office. Part number for sample order:
PC8182TB
ORDERING INFORMATION (Pb-Free)
Part Number Package 6-pin super minimold Marking C3F Supplying Form * Embossed tape 8 mm wide * Pin 1, 2, 3 face the perforation side of the tape * Qty 3 kpcs/reel
PC8182TB-E3-AZ*
*NOTE: Please refer to the last page of this data sheet, "Compliance with EU Directives" for Pb-Free RoHS Compliance Information.
Document No. PU10206EJ01V0DS (1st edition) (Previous No. P14543EJ2V0DS00) Date Published December 2002 CP (K)
(c) NEC Compound Semiconductor Devices 1999,
2002
PC8182TB
PIN CONNECTIONS
Pin No.
(Top View)
Pin Name INPUT GND GND OUTPUT GND
(Bottom View)
4
1
3
C3F
3 2 1
4 5 6
2 3 4
5 6
2 1
5
6
VCC
PRODUCT LINE-UP (TA = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 )
Part No. fu (GHz) 2.9 PO (1 dB) (dBm) +9.5 @ f = 0.9 GHz +9.0 @ f = 1.9 GHz +8.0 @ f = 2.4 GHz GP (dB) 21.5 @ f = 0.9 GHz 20.5 @ f = 1.9 GHz 20.5 @ f = 2.4 GHz 13.0 @ f = 0.9 GHz 15.5 @ f = 1.9 GHz 20.0 @ f = 0.9 GHz 21.0 @ f = 1.9 GHz 21.0 @ f = 0.9 GHz 21.0 @ f = 1.5 GHz 19.0 @ f = 0.9 GHz 21.0 @ f = 1.9 GHz 22.0 @ f = 2.4 GHz 23.0 36.0 27.0 26.5 6-pin minimold 6-pin super minimold 6-pin minimold 6-pin super minimold 6-pin minimold 6-pin super minimold 6-pin super minimold C3E C2H C2A C1Z ICC (mA) 30.0 Package 6-pin super minimold Marking C3F
PC8182TB
PC2762T PC2762TB PC2763T PC2763TB PC2771T PC2771TB PC8181TB
2.9
+8.0 @ f = 0.9 GHz +7.0 @ f = 1.9 GHz
2.7
+9.5 @ f = 0.9 GHz +6.5 @ f = 1.9 GHz
2.2
+11.5 @ f = 0.9 GHz +9.5 @ f = 1.5 GHz
4.0
+8.0 @ f = 0.9 GHz +7.0 @ f = 1.9 GHz +7.0 @ f = 2.4 GHz
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Caution The package size distinguishes between minimold and super minimold.
2
Data Sheet PU10206EJ01V0DS
PC8182TB
SYSTEM APPLICATION EXAMPLE
Digital cellular telephone
RX DEMOD. I Q
/N
PLL
SW
PLL
I 0 TX PA
: PC8182TB applicable
Phase shifter 90 Q
Caution The insertion point is different due to the specifications of conjunct devices.
Data Sheet PU10206EJ01V0DS
3
PC8182TB
PIN EXPLANATION
Applied Pin No. Pin Name Voltage (V) 1 INPUT - Pin Voltage (V)
Note
Function and Applications
Internal Equivalent Circuit
0.99
Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut.
6
4
OUTPUT Voltage as same as VCC through external inductor
-
Signal output pin. The inductor must be attached between VCC and output pins to supply current to the internal output transistors.
4
1
- Power supply pin, which biases the internal input transistor. This pin should be externally equipped with bypass capacitor to minimize its impedance.
6
VCC
2.7 to 3.3
2 3 5
GND
0
-
Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
3 GND
2
5 GND
Note Pin voltage is measured at VCC = 3.0 V.
4
Data Sheet PU10206EJ01V0DS
PC8182TB
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Total Circuit Current Power Dissipation Operating Ambient Temperature Storage Temperature Input Power Symbol VCC ICC PD TA Tstg Pin TA = +25C Test Conditions TA = +25C, pin 4 and pin 6 TA = +25C TA = +85C Note Ratings 3.6 60 270 -40 to +85 -55 to +150 +10 Unit V mA mW C C dBm
Note Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter Supply Voltage Symbol VCC MIN. 2.7 -40 TYP. 3.0 MAX. 3.3 Unit V C Remarks Same voltage should be applied to pin 4 and pin 6. Operating Ambient Temperature TA +25 +85 -
Data Sheet PU10206EJ01V0DS
5
PC8182TB
ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 , unless otherwise specified)
Parameter Circuit Current Power Gain Symbol ICC GP No signal f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz Noise Figure NF f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz Upper Limit Operating Frequency Isolation fu ISL 3 dB down below from gain at f = 0.1 GHz f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz Input Return Loss RLin f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz Output Return Loss RLout f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz Gain 1 dB Compression Output Power PO(1dB) f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz Saturated Output Power PO(sat) f = 0.9 GHz, Pin = -5 dBm f = 1.9 GHz, Pin = -5 dBm f = 2.4 GHz, Pin = -5 dBm Test Conditions MIN. - 19.0 18.0 18.0 - - - 2.6 28 27 26 5 7 9 7 8 11 +7.0 +6.5 +5.5 - - - TYP. 30.0 21.5 20.5 20.5 4.5 4.5 5.0 2.9 33 32 31 8 10 12 10 11 14 +9.5 +9.0 +8.0 +11.0 +10.5 +10.0 MAX. 38.0 25.0 24.0 24.0 6.0 6.0 6.5 - - - - - - - - - - - - - - - - dBm dBm dB dB GHz dB dB Unit mA dB
6
Data Sheet PU10206EJ01V0DS
PC8182TB
TEST CIRCUITS
VCC 1 000 pF C3 6 50 IN 1 000 pF C1 1 4 L C2 1 000 pF 50 OUT
2, 3, 5
COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS
Type C1, C2 C3 L Bias Tee Capacitor Bias Tee Value 1 000 pF 1 000 pF 1 000 nH
EXAMPLE OF ACTUAL APPLICATION COMPONENTS
Type C1 to C3 L Chip capacitor Chip inductor
Value 1 000 pF 100 nH 10 nH
Operating Frequency 100 MHz or higher 100 MHz or higher 2.0 GHz or higher
INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output transistor, connect an inductor between the Vcc pin (pin 6) and output pin (pin 4). Select large value inductance, as listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor makes output-port-impedance higher to get enough gain. In this case, large inductance and Q is suitable. For above reason, select an inductance of 100 or over impedance in the operating frequency. The gain is a peak in the operating frequency band, and suppressed at lower frequencies. The recommendable inductance can be chosen from example of actual application components list as shown above. CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS Capacitors of 1 000 pF are recommendable as the bypass capacitor for the Vcc pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the Vcc pin is used to minimize ground impedance of Vcc pin. So, stable bias can be supplied against Vcc fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2Rfc).
Data Sheet PU10206EJ01V0DS
7
PC8182TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-2
Top View
3
1
IN
OUT
C C
2
C
3F 5 4
Mounting direction
6
C
COMPONENT LIST
Value C L 1 000 pF Example: 10 nH
Notes 1. 30 x 30 x 0.4 mm double-sided copper-clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes
8
Data Sheet PU10206EJ01V0DS
L
VCC
PC8182TB
TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)
CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE
40 No Signal 35
Circuit Current ICC (mA) Circuit Current ICC (mA)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
40
No Signal 35 VCC = 3.0 V 30 25 20 15 10 5 1 2 3 4 0 -60 -40 -20 0 +20 +40 +60 +80 +100
30 25 20 15 10 5 0 0
Supply Voltage VCC (V)
Operating Ambient Temperature TA (C)
NOISE FIGURE, POWER GAIN vs. FREQUENCY
24 22
Power Gain GP (dB)
POWER GAIN vs. FREQUENCY
24 VCC = 3.0 V 22
Power Gain GP (dB)
GP VCC = 3.0 V
VCC = 3.3 V
TA = -40C
Noise Figure NF (dB)
20 18 16
20 18 16 14
VCC = 2.7 V
TA = +25C
TA = +85C
5 4 3
VCC = 3.3 V VCC = 3.0 V NF VCC = 2.7 V 0.3 1.0 3.0
14 12 0.1
12 0.1
0.3
1.0
3.0
Frequency f (GHz)
Frequency f (GHz)
ISOLATION vs. FREQUENCY
0 VCC = 3.0 V
Input Return Loss RLin (dB) Output Return Loss RLout (dB)
INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY
0 VCC = 3.0 V -10 -20 -30 -40 -50 0.1 RLin
-10
Isolation ISL (dB)
-20 -30 -40 -50 0.1
RLout
0.3
1.0
3.0
0.3
1.0
3.0
Frequency f (GHz)
Frequency f (GHz)
Data Sheet PU10206EJ01V0DS
9
PC8182TB
OUTPUT POWER vs. INPUT POWER
+15 +10
Output Power Pout (dBm)
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER
+15
f = 0.9 GHz +10 VCC = 3.0 V
f = 0.9 GHz
VCC = 3.3 V VCC = 2.7 V VCC = 3.0 V
+5 0 -5 -10 -15 -20 -25 -50 -40
+5 0 -5 -10 -15 -20
TA = +25C
TA = +85C TA = -40C
-30
-20
-10
0
+10
-25 -50
-40
-30
-20
-10
0
+10
Input Power Pin (dBm)
Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER
+15 +10
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER
+15
Output Power Pout (dBm)
f = 1.9 GHz
VCC = 3.3 V VCC = 3.0 V
f = 1.9 GHz +10 VCC = 3.0 V
+5 0 -5 -10 -15 -20 -25 -50 -40
+5 0 -5 -10 -15 -20
TA = +25C
TA = -40C
VCC = 2.7 V
TA = +85C
-30
-20
-10
0
+10
-25 -50
-40
-30
-20
-10
0
+10
Input Power Pin (dBm)
Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER
+15
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER
+15
f = 2.4 GHz +10 VCC = 3.0 V
+5 0 -5 -10 -15 -20 -25 -50 -40
VCC = 3.3 V VCC = 2.7 V VCC = 3.0 V
Output Power Pout (dBm)
+10
f = 2.4 GHz
+5 0 -5 -10 -15 -20
TA = +25C
TA = -40C TA = +85C
-30
-20
-10
0
+10
-25 -50
-40
-30
-20
-10
0
+10
Input Power Pin (dBm)
Input Power Pin (dBm)
10
Data Sheet PU10206EJ01V0DS
PC8182TB
3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE
-60 -50 -40 -30
VCC = 2.7 V
f1 = 900 MHz f2 = 902 MHz
+15
VCC = 3.0 V
+10
Output Power Pout (dBm)
+5 0 -5 -10 -15 -20 -25 -50 -40
f = 0.9 GHz f = 1.9 GHz f = 2.4 GHz
3rd Order Intermoduration Distortion IM3 (dBc)
OUTPUT POWER vs. INPUT POWER
VCC = 3.3 V VCC = 3.0 V
-20 -10 0 -15 -10 -5 +5 +10
-30
-20
-10
0
+10
0
Input Power Pin (dBm)
Output Power of Each Tone PO(each) (dBm)
3rd Order Intermoduration Distortion IM3 (dBc)
-60 -50 -40 -30
VCC = 3.0 V
3rd Order Intermoduration Distortion IM3 (dBc)
3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE
f1 = 1 900 MHz f2 = 1 902 MHz
VCC = 3.3 V
3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE
-60 -50 -40 -30 -20 -10 0 -15 -10 -5 +5 +10
f1 = 2 400 MHz f2 = 2 402 MHz
VCC = 3.3 V VCC = 3.0 V VCC = 2.7 V
-20 -10 0 -15 -10
VCC = 2.7 V
-5
0
+5
+10
0
Output Power of Each Tone PO(each) (dBm)
Output Power of Each Tone PO(each) (dBm)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10206EJ01V0DS
11
PC8182TB
SMITH CHART (VCC = Vout = 3.0 V)
S11-FREQUENCY
0.1 G
3.0 G
1.0 G
S22-FREQUENCY
0.1 G 1.0 G 3.0 G
12
Data Sheet PU10206EJ01V0DS
PC8182TB
S-PARAMETERS
S-parameters/Noise parameters are provided on the NEC Compound Semiconductor Devices Web site in a form (S2P) that enables direct import to a microwave circuit simulator without keyboard input. Click here to download S-parameters. [RF and Microwave] [Device Parameters] URL http://www.csd-nec.com/
Data Sheet PU10206EJ01V0DS
13
PC8182TB
PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm)
2.10.1 1.250.1
2.00.2
1.3
0.65
0.65
0.1 MIN.
0.90.1
0.7
14
Data Sheet PU10206EJ01V0DS
0 to 0.1
0.15+0.1 -0.05
0.2+0.1 -0.05
PC8182TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC pin. (4) The inductor must be attached between VCC and output pins. The inductance value should be determined in accordance with desired frequency. (5) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) VPS Peak temperature (package surface temperature) Time at temperature of 200C or higher Preheating time at 120 to 150C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 215C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 VP215 Condition Symbol IR260
For soldering
Preheating temperature (package surface temperature) : 120C or below
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10206EJ01V0DS
15
4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information.
Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative.
Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL's liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.

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